Cu precipitation dynamics in Fe-Cu alloy

Co-Precipitation, Strength and Electrical Resistivity of Cu–26 wt % Ag–0.1 wt % Fe Alloy

Both a Cu-26 wt % Ag (Fe-free) alloy and Cu-26 wt % Ag-0.1 wt % Fe (Fe-doping) alloy were subjected to different heat treatments. We studied the precipitation kinetics of Ag and Cu, microstructure evolution, magnetization, hardness, strength, and electrical resistivity of the two alloys. Fe addition was incapable of changing the precipitation kinetics of Ag and Cu; however, it decreased the siz...

Molecular dynamics simulation of Al–Co–Cr–Cu–Fe–Ni high entropy alloy thin film growth

Alignment of Fe-rich Primary Phase in Cu–Fe Alloy Solidified under a High Magnetic Field

1) Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang, 110004 China. E-mail: [email protected], [email protected], [email protected], [email protected] 2) Graduate School of Engineering, Nagoya University, Nagoya, 464-8603 Japan. E-mail: [email protected] 3) EcoTopia Science Institute, Nagoya University, Na...

TEXTURE AND RESISTIVITY OF Cu and DILUTE Cu ALLOY FILMS

Annealing of dilute binary Cu(Ti), Cu(In), Cu(Al), Cu(Sn), Cu(Mg), Cu(Nb), Cu(B), Cu(Co) and Cu(Ag) alloy films resulted in the strongest <111> fiber texture for Cu(Ti) and the lowest resistivity for Cu(Ag). The behavior of the alloy films was compared and contrasted with that for a pure evaporated Cu film. Electron beam evaporated films with compositions in the range of 2.0-4.2 at% and thickne...

Texture of Cu and Dilute Binary Cu-Alloy Films:

The impact of 11 alloying elements, namely Mg, Ti, In, Sn, Al, Ag, Co, Nb and B, at two nominal concentration of 1 and 3 at.%, and Ir and W, at only a nominal concentration of 3 at.%, on the evolution of texture of Cu was investigated. The behavior of the alloy films was compared with that for pure Cu films. The films were electron beam evaporated onto oxidized Si wafers and had thicknesses in ...